JPH0648869Y2 - 冷却構造 - Google Patents

冷却構造

Info

Publication number
JPH0648869Y2
JPH0648869Y2 JP1989135400U JP13540089U JPH0648869Y2 JP H0648869 Y2 JPH0648869 Y2 JP H0648869Y2 JP 1989135400 U JP1989135400 U JP 1989135400U JP 13540089 U JP13540089 U JP 13540089U JP H0648869 Y2 JPH0648869 Y2 JP H0648869Y2
Authority
JP
Japan
Prior art keywords
cooling
integrated circuit
heat
circuit element
heat conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989135400U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0375543U (en]
Inventor
俊一 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989135400U priority Critical patent/JPH0648869Y2/ja
Publication of JPH0375543U publication Critical patent/JPH0375543U/ja
Application granted granted Critical
Publication of JPH0648869Y2 publication Critical patent/JPH0648869Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989135400U 1989-11-24 1989-11-24 冷却構造 Expired - Fee Related JPH0648869Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989135400U JPH0648869Y2 (ja) 1989-11-24 1989-11-24 冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989135400U JPH0648869Y2 (ja) 1989-11-24 1989-11-24 冷却構造

Publications (2)

Publication Number Publication Date
JPH0375543U JPH0375543U (en]) 1991-07-29
JPH0648869Y2 true JPH0648869Y2 (ja) 1994-12-12

Family

ID=31682670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989135400U Expired - Fee Related JPH0648869Y2 (ja) 1989-11-24 1989-11-24 冷却構造

Country Status (1)

Country Link
JP (1) JPH0648869Y2 (en])

Also Published As

Publication number Publication date
JPH0375543U (en]) 1991-07-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees